TSMC’s 2031 upside is less “new product” and more scarcity-powered throughput + mix: leading-edge logic and
advanced packaging stay structurally constrained by tool supply, yield ramps, and qualification cycles, supporting durable
utilization and pricing. The incremental non-linear lever is moving up the stack from “wafers sold” to “outcomes guaranteed” (
take-or-pay capacity blocks, delivery SLAs, and security/assurance attach), which should reduce cyclicality and defend margins in a compute-hungry world even as overseas capacity expands.