This is a scarcity compounder, not a moonshot. AI demand is broadening from accelerator chips into CPUs,
custom silicon, networking and edge systems, and TSMC still owns the hardest manufacturing and packaging choke points. Additive upside comes from tighter
take-or-pay capacity contracts and resilience products. Because the company is already enormous and capital intensive, upside should come mostly from durable revenue compounding rather than multiple expansion.